Conduction Path Formation Mechanism of Solderable Polymer Composites with Low-Melting-Point Alloy/High-Melting-Point Alloy Mixed Filler
نویسندگان
چکیده
منابع مشابه
Melting Point Determination
An improved technique is described for the accurate determination of melting points of metals in the temperature range 1500° to 2500°C. The improvements consist of gradient heating and refinements in cavity preparation to obtain true black-body conditions. The melting point of hafnium, as determined by this method, is set a t 22220-+30°C. This is over 200°C higher than one of the values reporte...
متن کاملHeat capacity of rare earth metals near the melting point and the vacancy mechanism of melting
The vacancy mechanism of the melting process is utilized as a starting point for deriving the formula for the difference of the heat capacity of the liquid and solid metal in the neighbourhood of the melting point. From these calculations it follows that the difference C,, C,, is the same for all the metals and equals 3.50 J g.atom-' K-'. This result is compared with the existing in the literat...
متن کاملRationalization of nanowire synthesis using low-melting point metals.
In this paper, we provide a theoretical basis using thermodynamic stability analysis for explaining the spontaneous nucleation and growth of a high density of 1-D structures of a variety of materials from low-melting metals such as Ga, In, or Sn. The thermodynamic stability analysis provides a theoretical estimate of the extent of supersaturation of solute species in molten metal solvent. Using...
متن کاملSolid clusters above the bulk melting point
The fact that the melting points of nanoparticles are always lower than those of the corresponding bulk material is a paradigm supported by extensive experimental data for a large number of systems and by numerous calculations. Here we demonstrate that tin cluster ions with 10-30 atoms remain solid at approximately 50 K above the melting point of bulk tin. This behavior is possibly related to t...
متن کاملPrinting low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.
A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi35In48.6Sn16Zn0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electr...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2020
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.mt-m2019285